PRINTED CIRCUIT BOARD ASSEMBLY + TEST

A key feature of Glentronics' electronics manufacturing service is a printed circuit board assembly and test capability comprising leading edge surface mount assembly lines together with automatic, semi-automatic and manual through-hole assembly.

Capabilities

• Medium volume surface mount pick and place
• Low volume surface mount pick and place
• Prototype surface mount pick and place (TWS Quadra)
• Screen printing (DEK 260&265)

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• Automatic surface mount paste and glue
• Automatic through hole DIP, Radial and Axial insertion
• Double sided and mixed technology Printed Circuit Board Assembly
• Convection re-flow solder
• Chip and lambda wave solder
• MDA, Functional, In-circuit and Flying Probe testing

Component Technology

Components from 0.5mm x 1mm (0402) to 50mm x 50mm (chip, SOT, MELF, Mini-MELF, QFP, TSOP & Ball Grid Arrays) to 0.016 inch pitch.